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Preparation and properties of heat-sealable polyimide films with comparable coefficient of thermal expansion and good adhesion to copper matrix

机译：具有可比热膨胀系数和对铜基体的良好粘附性的可热封聚酰亚胺薄膜的制备和性能

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X. M. Zhang; X. Xiao; X. Wu; J. G. Liu;
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1. Preparation and Properties of Inherently Black Polyimide Films with Extremely Low Coefficients of Thermal Expansion and Potential Applications for Black Flexible Copper Clad Laminates [J] . International journal of applied mechanics . 2020,第3期

机译：具有极低热膨胀系数的固有黑色聚酰亚胺膜的制备与性能及黑色柔性铜包层压板的潜在应用
2. Construction of stable hydrogen bonds at high temperature for preparation of polyimide films with ultralow coefficient of thermal expansion and high Tg [J] . Polymer: The International Journal for the Science and Technology of Polymers . 2020,第期

机译：高温稳定氢键的构建，用超级热膨胀和高TG制备聚酰亚胺膜
3. A Novel Preparation of Polyimide/Clay Hybrid Films with Low Coefficient of Thermal Expansion [J] . AIJUAN GU, FENG-CHIH CHANG Journal of Applied Polymer Science . 2001,第2期

机译：低热膨胀系数聚酰亚胺/粘土杂化膜的新型制备
4. Adhesion Properties of Copper/Polyimide Film Modified by Reactive Ion Etching(RIE) [C] . W. J. Lee, Yoon. B. Kim, W. Y. Lee, IUMRS International Conference in Asia . 2007

机译：反应离子蚀刻改性铜/聚酰亚胺膜的粘附性能（RIE）
5. Fabrication, thermal expansion, thermal conductivity, and mechanical properties of high particulate volume fraction aluminum-matrix composites. [D] . Lai, Shy-Wen. 1993

机译：高颗粒体积分数铝基复合材料的制造，热膨胀，导热性和机械性能。
6. Preparation and Properties of Inherently Black Polyimide Films with Extremely Low Coefficients of Thermal Expansion and Potential Applications for Black Flexible Copper Clad Laminates [O] . Yao-yao Tan, Yan Zhang, Gang-lan Jiang, 2020

机译：热膨胀系数极低的固有黑色聚酰亚胺薄膜的制备和性能及其在黑色柔性覆铜箔层压板中的潜在应用
7. Preparation and Properties of Inherently Black Polyimide Films with Extremely Low Coefficients of Thermal Expansion and Potential Applications for Black Flexible Copper Clad Laminates [O] . Yao-yao Tan, Yan Zhang, Gang-lan Jiang, 2020

机译：具有极低热膨胀系数的固有黑色聚酰亚胺薄膜的制备与性能及黑色柔性铜包层压板的潜在应用

Preparation and properties of heat-sealable polyimide films with comparable coefficient of thermal expansion and good adhesion to copper matrix

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